• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Device for electronically detecting the heat emission of a radiator, comprising a metallic back (2), a housing (3) and a circuit board (7) with at least one radiator temperature sensor (6) and at least one room temperature sensor (13) for measuring the ambient temperature, wherein the room temperature sensor (13) is held by means of elastically deformable heat insulating material in a recess (15) of a housing wall (14).
    公开号:AT13072U1
    申请号:TGM105/2012U
    申请日:2012-03-20
    公开日:2013-05-15
    发明作者:
    申请人:Mestechnik Ges M B H & Co Kg Energieverrechnung Contracting Facility Man；
    IPC主号:
    专利说明:

    9am) d > i $ he / she: i AT13 072U1 2013-05-15
    Description: The invention relates to a device for electronically detecting the heat output of a radiator, comprising a metallic back, a housing and a circuit board having at least one radiator temperature sensor and at least one room temperature sensor for measuring the ambient temperature.
    Such devices for measuring the amount of heat emitted, in particular a hot-water radiator in the context of central heating are usually synonymous briefly and hereinafter also referred to as heating costs distributor. Such devices, as described in DE 20 2008 009 278 and DE 20 2009 011 309, are used to determine the distribution of heating costs in multi-family dwellings heated by means of a water central heating system. The invention relates to a generic electronic device. Such electronic heat cost allocators have a mounting back made of metal, usually aluminum, which is attached directly to the radiator or radiator by means of screws, nuts and / or bolts. These backs serve on the one hand for stable attachment of the heat cost allocator on the radiator to be measured, on the other hand for receiving and forwarding the heat of the radiator to the temperature sensor of the electronic heat cost allocator. The temperature sensor and the electronics are arranged within a housing usually made of plastic, which rests on the back, if necessary, this also engages laterally and protects the electronics located in it. The housing is secured against unlawful opening and removal of the back by means of a so-called seal, which usually engages in a groove of the back. The opening of the housing or removal from the back is possible only with destruction of the seal, whereby such a process can be seen on a destroyed seal.
    Also, the forwarding of the temperature of the plastic housing, representative of the room temperature, to a arranged on the board room temperature sensor is also a decisive factor for the accurate measurement and high Kostenverteilerrigkeit and therefore to ensure devices in the two-sensor principle.
    Especially the two-probe measurement with a room temperature sensor is crucial to achieve a high Kostenverteilgerechtigkeit. The problem is the measurement of the room temperature outside the heat cost allocator. The fact that the board heats up due to the proximity to the radiator, and a correspondingly good heat conduction between the radiator and the board, however, an arrangement of the room temperature sensor on the board can lead to falsified results, since the room temperature sensor measures in this case too high a temperature.
    Proceeding from this, the present invention seeks to provide an improved device for electronically detecting the heat output of a radiator.
    According to the invention, the stated object is achieved in a generic device in that the room temperature sensor is held by means of elastically deformable heat insulating material in a recess of a housing wall.
    For the production of a board with electronic elements, a room temperature sensor is fixed to a connected to a board via struts sensor carrier; for assembling the device for electronically detecting the heat output of a radiator, the sensor carrier is broken out of the board; the board is placed on a board carrier such that a mandrel on the board carrier protrudes through an opening in the board; Heat insulating material is placed on the mandrel; the sensor carrier with the carried by him on the side facing away from the board face of the Wärmeisoliermaterials placed; the upper housing part is placed on the platinum carrier, so that the sensor carrier projects into the recess in the wall of the housing upper part.
    It is particularly preferably provided that the room temperature sensor by means of a dome, which is located below the Wärmeisoliermaterials, held in the recess 1/15 isteTOdiiscises föfeütäWi AT13072U1 2013-05-15 is, and that the mandrel part of a platinum carrier within the housing is.
    The invention further provides particularly preferred that the mandrel on the platinum carrier extends perpendicular to the platinum support plane in the direction of the upper housing part, and protrudes through an opening in the board through the latter and that the heat insulating material is attachable to the mandrel, wherein the Heat insulating material is cylindrical and preferably consists of foam. The equipped with the room temperature sensor sensor carrier can be placed on an end face of the cylindrical Wärmeisoliermaterials, wherein the sensor carrier projects into the recess. The consisting of a piece of foam heat insulating material is dimensioned such that the sensor carrier not only protrudes into the recess in the upper housing part, but is easily pressed into the recess. This has the effect that the sensor carrier with the room temperature sensor is pressed against the inner wall of the recess of the housing upper part by the heat insulating material, whereby a normal force acts on the surface of the room temperature sensor and this is held in a force-locking manner in the recess. A thermal decoupling of the room temperature sensor from the temperature of the board and at the same time a good coupling of the outside temperature to the heat cost allocator to the room temperature sensor are guaranteed.
    Preferably, it can be provided that the recess is formed within a wall of a housing upper part, which is dimensioned such that the sensor carrier with equipped room temperature sensor can be used with game. In this case, the sensor carrier does not have to be arranged exactly centered on the foam cylinder, but has due to the wide depression a certain freedom in the placement. When closing the upper housing part, the risk is reduced that the sensor carrier is accidentally pinched or misplaced. If required, the sensor carrier can be connected to an additional thermally conductive part. Such may be a thermally conductive connection between the upper housing part and the room temperature sensor, such as a thermally conductive plastic.
    It is preferably provided that the board is connected by means of a platinum carrier to the housing, wherein it is provided prior to installation that a part of the board is designed as a sensor carrier for the room temperature sensor. By definition, such a board is an initially unpopulated support for electronic components, e.g. a printed circuit board which consists of an electrically insulating material with conductive connections (interconnects) adhering thereto. It is further provided that prior to installation of the board, the sensor carrier is connected to the rest of the board via thin struts, so that the sensor carrier is breakable from the board. The board can thus be equipped with the electronic components in one work step, after which the sensor carrier can be broken out of the board. For this purpose, apertures are incorporated in the board, which have an elongated shape and are formed in a frontal region of the board. The apertures line up along a U-shape with a narrow distance behind each other, so that a rectangular shaped sensor carrier remains, which is connected by thin struts with the rest of the board. It is preferably provided that the openings have rounded end regions, so that the struts are formed centrally tapered. As a result, a predetermined breaking point is given at the point of the narrowest taper. The sensor carrier can be easily broken out of the circuit board manually or with a suitable tool. Furthermore, it is particularly preferred that the board has openings and / or recesses through which parts of the device can be inserted, such as e.g. an antenna or a contact fuse.
    A preferred embodiment of the invention provides for sealing an engaging from the outside through the housing upper part securing part with two provided with undercuts spring struts, which engage in undercuts formed on a back rail, while an edge region of the opening of the upper housing part overlapped by a head of the security part is, so as to secure the upper housing part mechanically on the back. This ensures on the one hand that the seal so defined is already guided by the channel when inserted in the correct position, on the other hand, after locking with the profile channel of the back separation of the housing from the back is possible only with destruction of the seal. 2.15
    A preferred embodiment of the invention provides for securing against unauthorized opening of the device in the operating state at a distance from a formed on the board electrically conductive contact pad held contact tongue, wherein the contact tongue and contact field in an electrical signal circuit are connected, and in particular the contact tongue is held by a seated on the back of the board penetrating pin in the operating state at a distance from the contact field. This ensures that there is no accidental electrical contact, which would falsely indicate an unauthorized opening.
    A preferred embodiment further provides the transmission by means of transponders in RFID technology. As a result, energy can be transmitted during the reading process from the outside for carrying out the communication, so that the life of the battery in the housing is spared.
    To produce a device according to the invention for the electronic detection of the heat output of a radiator is particularly preferably provided that in the assembly of a board with electronic elements, a room temperature sensor is soldered to a connected to the board via struts sensor carrier. In a next step, it is provided that after the board and the sensor carrier, the latter is carefully broken out of its holder. For further assembly, the assembled board is placed on the board carrier, so that a mandrel protrudes on the board carrier through an opening in the board. Thereafter, heat insulating material is placed in the form of a foam cylinder on the mandrel, the sensor carrier placed on the side facing away from the board face of the Wärmeisoliermaterials and set the upper housing part on the platinum carrier, so that the sensor carrier projects into the recess in the wall of the upper housing part.
    Further advantages and features of the invention will become apparent from the claims and from the following description in which the invention with reference to the drawings is explained in detail. FIG. 1 shows a perspective view of a heat cost allocator according to the invention with a partially perforated housing; FIG. Fig. 2 is a perspective view of a heat cost allocator according to the invention without upper housing cover; Fig. 3 is an enlarged detail of Figure 1 on an arrangement of a Raumtem peratursensors in a recess of a housing upper part. FIG. 4 is a schematic view of a circuit board; FIG. FIG. 5 shows an enlarged detail according to FIG. 3 of a sensor carrier; FIG. and [0022] FIG. 6 shows a cross section through a heat cost allocator according to the invention in the region of a radiator temperature sensor.
    The inventive device for electronic detection of the heat output of a radiator, short electronic heat cost allocator 1, according to FIG. 1, a back part 2 and a housing 3 with other elements in the interior. The back 2 is made of metal, usually aluminum, and is used to mount the heat cost allocator 1 to a radiator.
    The housing 3 is formed of plastic and has an upper housing part 4 and in its interior a platinum carrier, which are locked together. In Fig. 2, the heat cost allocator 1 is shown rotated for a better overview without the upper housing part 4 and Fig. 1 in the board plane by 90 °. The board carrier 5 carries a with electronic components, u.a. a radiator temperature sensor (shown in Fig. 5), assembled board 7. The board 7 itself is held on holding plate 8 on the board carrier 5 at the same.
    The platinum carrier 5 has a mandrel 9, which is directed away from the radiator to the housing upper part 4, wherein the mandrel 8 is perpendicular to the platinum support plane. 3 shows an enlarged view of the dome 9. The mandrel 9 protrudes through an opening 10 in the board 7 therethrough, wherein the opening 10 is dimensioned such that the mandrel 9 in the opening 10th Game has. About the mandrel 9 heat insulating material in the form of a foam piece 11 is arranged. The heat insulating material is preferably elastically or plastically deformable and can be made in addition to foam and other elastic plastic-containing materials, wherein the shape as such may be different. In this embodiment, the foam piece 11 has a cylindrical shape, as can be seen in Fig. 1. On this foam piece 11, a sensor carrier or short carrier 12 is placed on the upper side facing the upper housing part 4, which is equipped with a room temperature sensor 13. On the temperature sensor 13 connecting wires 13 a are further attached, which connect the room temperature sensor 13 to the circuit board 7. The carrier 12 is formed from a breakable from a larger board piece of board, as will be explained in more detail. The foam piece 11 serves on the one hand as a mechanical protection of the underside of the carrier 12 in front of the tip of the dome 9 and on the other hand as thermal insulation to thermally decouple the room temperature sensor 13 from the temperature of the board 7, which has a higher temperature due to their proximity to the radiator as the housing upper part directed towards the room 4.
    So that the room temperature sensor 13 can be coupled to the outside of the heating cost allocator 1 prevailing outside temperature, a recess 15 is formed in a wall 14 of the upper housing part 4 to the upper end side of the foam piece 11, in which the support 12 projects with the room temperature sensor 13. The recess 15 is formed in the longitudinal section of FIG. 3 rectangular with rounded corners, wherein the recess 15 is dimensioned such that the sensor carrier 12 is generously encompassed with soldered temperature sensor 13 in its width, height and depth of the recess 15. The curvature of the recess 15 keeps the sensor 13 in spite of the floating support 12 heat-insulated in place, the support 12 is arranged with play in the recess 15. Thus, it is avoided during assembly of the heat cost allocator 1, that the carrier 12 accidentally or by oblique placement on the show piece of material 11 is displaced or clamped.
    In Fig. 4, the board 7 is shown schematically in a prefabricated step, even before the board 7 is equipped with the components and is installed in the heat cost allocator 1. The board 7 has at several points differently sized and differently shaped openings or openings and recesses, which is provided for attachment or installation of electronic components and other components of the device.
    In a left half of the image shown in Fig. 4, a circular opening 10 is formed centrally of the width of the board 7, which is dimensioned with respect to FIG. 2 such that the mandrel 9, without the border of the opening 10 to touch, can protrude through them. For an electromechanical fuse, a contact pad 16a is provided, which is generally gold-plated. Furthermore, the opening 16b is used to attach the electromechanical fuse. Furthermore, an opening for fixing a seal can be provided, as described in DE 20 2008 009 278.
    Another circular opening 16c is provided for attachment of a helical antenna for radio transmission. The board 7 has openings 17, in which a heat conductor for the radiator temperature sensor 6 can be hooked. Furthermore, a rectangular contact field 18 is formed on the board 7, which serves for soldering an LCD display. In the frontal region of the circuit board 7, which adjoins the contact field 18, a rectangular recess 19 is formed, in which the sensor carrier 12 is attached with thin struts 20a on the board 7, as well as Fig. 5 illustrates in an enlarged section of this area. The sensor carrier 12 is already connected in FIG. 4 to connection wires 13 a, which connects the room temperature sensor 13 to the electronics of the circuit board 7. The sensor carrier 12 may have a recess or recess that is shaped in accordance with the size of the room temperature sensor 13 for easy placement of the temperature sensor 13.
    In Fig. 5 it is shown that for the formation of the struts 20 a elongated openings 20 b with
    "Set" "AT 13 072 Ul 2013-05-15 rounded ends are formed as they are e.g. caused by etching or drilling. The openings 20b are lined up in a U-shaped manner at specific intervals. The struts 20a are not straight, but have due to rounded ends of the apertures 20b in its central region a taper, which has only 0.2 mm width at its thinnest point in this embodiment. In comparison, the carrier 12 has a width of 4.6 mm and a length of about 7 mm. The struts 20a are each arranged in the middle of the two end faces and in the middle of one of the longitudinal sides of the carrier 12. Because the struts 20a are tapered in the center, the support 12 can be broken out of the circuit board 7 with little effort. This type of production serves to equip the board in a single operation with all important components, to calibrate the temperature sensors in one step and then carry out the assembly.
    In Fig. 6, the heat coupling of the arranged on the board 7 radiator temperature sensor 6 is described; in addition, reference is made to DE 20 2008 009 278. It is arranged for a good heat-conducting connection between the back 2 and the radiator temperature sensor 6 between the two a heat conductor 21. The heat conductor 21 has on its support side to the back part 2 a double-wave-shaped profile 21a with two wave crests 21b and a trough 21c located between them. This double-wave form enlarges the contact surface with the rear part 2 with respect to a heat conductor with only one contact projection and nevertheless always defines the contact surfaces exactly over the formed two contact lines. On the side facing away from the double-wave profile 21a, the heat conductor 21 is provided with two feet 21d, by means of which it passes through the openings 17 of the board 7. At the ends of the feet 21 d slots 21 e are formed on the inside thereof. In this a locking plate 22 is inserted, acts on a coil spring 23, which finds its other abutment on an inwardly projecting projection 24 of the housing upper part 4 and is centered by an elongated pin 25 of the projection 24. As a result, the heat conductor 21 is resiliently pressed by the spring 23 via the locking plate 22 and thus firmly and reliably against the rear part 2, whereby a reliable heat transfer between this and the radiator temperature sensor 6 is ensured.
    The heat cost allocator 1 according to the invention further comprises an electromechanical fuse 26 (see Fig. 1). This has a through the platinum carrier 5 and the board 7 extending columnar plastic pin (not shown), which has a disc-like thickening between platinum carrier 5 and board 7 to about 2/3 of its length from the back part 2, which protects him from the Space between board 7 and board carrier 5 to fall out.
    Part of the electromechanical fuse 26 is further a contact tongue 26a, which is fixed at one end to the board 7 and rests with its other end on the pin and from this in the assembled state of the housing 3 and the rear part 2 at a distance from this electrically conductive pad (not shown) is held on the board 7. If the housing 3 is released from the back part 2, the pin lacks the resistance of the back part 2, it can escape under the pressure of the contact tongue, so that it comes with its free end in electrical contact with the contact pad. The contact thus produced is detected by a likewise located on the board 7 processor of the heat cost allocator 1, stored and displayed on a display. In this way, unlawful separation from the housing 3 with the board 7 located in it can be detected by the back part 2 fixedly arranged on the heating body. Part of the mechanical security is still a seal 27, which is described in detail in DE 20 2008 009 278.
    The upper housing part 4 further comprises a transparent window 28 made of plastic, which protects an underlying, seated on the board 7 LCD display 29. The window 28 closes the housing 3, wherein the window 28 must be pressed into a recess 30 in the housing part 4, without the need for additional adhesive or other fastening material. To operate the heat cost allocator 1, a battery 31 is disposed in the lower region thereof. The platinum carrier 5 is stepped to receive the battery 31, wherein the gradation 32 terminates with the rear part 2. 5.15
    Merrecfcische ;; AT13 072U1 2013-05-15 For the radio transmission of the consumption data to a data collector, a helix antenna 33 is arranged on the circuit board 7. The data transmission can continue to take place by means of a transponder in RFID technology, for which purpose an RFID coil 34 is arranged as a conductor track coil on the circuit board 7. The service life of the battery 31 is not impaired by the data transmission or communication, since in this case the required energy is provided by the readout device via the RFID technology to the electronic heat cost allocator 1.
    For the manufacture or assembly of the heat cost allocator 1 according to the invention, the following steps are carried out successively.
    First, the board 7 is equipped with the necessary electronic components, such as e.g. the soldering of the temperature sensors 6,13, attaching the display 29, etc. The room temperature sensor 13 is soldered by means of connecting wires 13 a to the electronics of the board 7. Thereafter, the room temperature sensor 13 and the radiator temperature sensor 6 are calibrated together to ensure an accurate temperature measurement. Thereafter, the sensor carrier 12 is carefully removed from the circuit board 7 manually or with the aid of a suitable tool, such as a pair of pliers. The struts 20a break because of their narrow, centrally tapered design very easily in their midst. The carrier 12 is thus triggered without damage from the board 7.
    The board 7 is placed in the preassembled heating cost allocator 1 on the platinum carrier 5 and locked with the retaining hooks 8 of the platinum carrier 5. The mandrel 9 protrudes through the cut into the board 7 opening 10 therethrough. The other components, such as the fuse 26, seal 27, heat conductors 21, etc. are fixed in the openings and openings provided in the board 7 in part by latching.
    Foam as the preferred heat insulating material is cut into a corresponding cylindrical shape and placed as a foam piece 11 on the mandrel 9. For feeding the cable 13 a, the display material piece 11 can be provided with a cut. This allows an ordered cable feed. The sensor carrier 12 with attached room temperature sensor 13 is placed on the foam piece 11, wherein a thin adhesive layer may be provided. The room temperature sensor 13 is connected to the electronics of the heat cost allocator 1 by means of electrical lines 13a, preferably by soldering.
    The upper housing part 4 is placed, wherein upon engagement of the upper part 4 in the corresponding retaining hooks of the platinum support 5 and the lower housing part of the room temperature sensor 13 projects into the recess 15, where it comes to rest and held by the dome 9 in this frictionally. Due to the elasticity of the foam, the room temperature sensor 13 is not only frictionally held in the recess 15, but pressed lightly against the inside of the wall 14. This ensures a particularly good heat transfer from outside via the wall 14 of the upper housing part 4 to the room temperature sensor 13.
    REFERENCE LIST 1 Heating cost allocator 2 Rear part 3 Housing 4 Housing top 5 Platinum carrier 6 Radiator temperature sensor 7 Circuit board 8 Retaining hook 9 Mandrel 10 Mandrel opening 6/15
    foam piece
    sensor support
    Room temperature sensor
    leads
    Wall housing upper part
    deepening
    Contact field electronical fuse opening electromechanical fuse
    Bore helical antenna opening seal
    Breakthroughs heat conductor
    Contact field LCD display
    Recess sensor carrier
    pursuit
    Breakthroughs heat conductor
    profile
    Wellenberg
    Wellental feet
    slots
    Locking plate Coil spring Projection Upper housing part Pivot electromechanical safety device
    contact tongue
    display
    Window LCD display
    recess
    battery
    gradation
    Helix antenna RFID coil
    权利要求:
    Claims (17)
    [1]


    A device for electronically detecting the heat output of a radiator, comprising a metallic rear part (2), a housing (3) and a circuit board (7) with at least one radiator temperature sensor (6) and at least one Room temperature sensor (13) for measuring the ambient temperature, characterized in that the room temperature sensor (13) by means of elastically deformable Wärmeisoliermaterial in a recess (15) of a housing wall (14) is held.
    [2]
    2. Apparatus according to claim 1, characterized in that the room temperature sensor (13) by means of a mandrel (9), which is arranged below the Wärmeisoliermaterials, is held in the recess (15).
    [3]
    3. Device according to claim 1 or 2, characterized in that the mandrel (9) is part of a platinum carrier (5) within the housing (3).
    [4]
    4. Device according to one of claims 1 to 3, characterized in that the mandrel (9) on the platinum carrier (5) perpendicular to the platinum carrier plane in the direction of the upper housing part (4), and extends through an opening (10) in the board (7 ) protrudes through the latter.
    [5]
    5. Device according to one of claims 1 to 4, characterized in that the heat insulating material on the mandrel (9) can be plugged, wherein the heat insulating material is cylindrical and preferably consists of foam.
    [6]
    6. Device according to one of claims 1 to 5, characterized in that a part of the board (7) is designed as a sensor carrier (12) for the room temperature sensor (13).
    [7]
    7. The device according to claim 6, characterized in that prior to installation of the board (7) of the sensor carrier (12) with the remaining board (7) via thin struts (20 a) is connected, so that the sensor carrier (12) from the board ( 7) is breakable.
    [8]
    8. Device according to one of claims 1 to 7, characterized in that the with the room temperature sensor (13) populated sensor carrier (12) rests on an end face of the cylindrical Wärmeisoliermaterials, wherein the sensor carrier (12) in the recess (15) protrudes.
    [9]
    9. Device according to one of claims 1 to 8, characterized in that by the Wärmeisoliermaterial the sensor carrier (12) with the room temperature sensor (13) to the inner wall of the recess (15) of the upper housing part (4) is pressed, whereby a normal force the surface of the room temperature sensor (13) acts and this is frictionally held in the recess (15).
    [10]
    10. Device according to one of claims 1 to 5, characterized in that the recess (15) within a wall (14) of a housing upper part (4) is formed.
    [11]
    11. Device according to one of the preceding claims, characterized by a heat-conductive connection between the upper housing part (4) and the room temperature sensor (13).
    [12]
    12. The device according to claim 1, characterized in that the circuit board (7) by means of a platinum carrier (5) with the housing (3) is connected.
    [13]
    13. The apparatus according to claim 12, characterized in that for the connection of the platinum carrier (5) together with the board (7) on the upper housing part (4) the latter is provided on one end side with a groove, in which tabs of the platinum carrier (5) intervene, while the other end face of the upper housing part (4) has undercuts, engage in the holding hooks (8) of the platinum carrier (5).
    [14]
    14. Device according to one of the preceding claims, characterized by a purely destructible releasable mechanical connection between the housing (3) and the rear part by means of a seal (27). 8.15

    estefrechische AT 13 072 Ul 2013-05-15
    [15]
    15. The apparatus according to claim 14, characterized in that the seal (27) in a channel adapted to its cross-section in a specific orientation insertable and with moldings on the back (2) is positively connected.
    [16]
    16. Device according to one of the preceding claims, characterized in that a transparent cover (window (28)) of an LCD display (29) is positively held by projections in the upper housing part (4).
    [17]
    17. Device according to one of the preceding claims, characterized in that the device has a transponder for data transmission by means of RFID technology. For this 6 sheets drawings 9/15
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    同族专利:
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE202008009279U1|2008-07-10|2009-11-12|Meßtechnik Gesellschaft m.b.H. & Co. KG Energieverrechnung-Contracting-Facility Management|Device for detecting the heat output of a radiator|
    DE202009011309U1|2009-08-19|2010-09-23|Messtechnik Ges. M.B.H. & Co. Kg|Device for the electrical detection of the heat emission of a radiator|DE102015001585A1|2015-02-11|2016-08-11|Kundo Xt Gmbh|Heating cost allocator and heating cost meter|DE10146207C5|2001-09-19|2006-07-06|Kundo Systemtechnik Gmbh|Device for measuring the heat output of a radiator|
    DE202004007802U1|2004-05-14|2005-09-22|Diehl Ako Stiftung & Co. Kg|Electronic meter for heating costs containing circuit board and sensors in casing, includes thermal insulator which intervenes between front and rear sections of casing|
    DE202008009278U1|2008-07-10|2009-11-12|Meßtechnik Gesellschaft m.b.H. & Co. KG Energieverrechnung-Contracting-Facility Management|Device for detecting the heat output of a radiator|
    DE102009048940B3|2009-10-10|2010-10-14|Qundis Gmbh|Unit to measure heat emitted by a heating body has a housing containing a sensor for the body temperature and a separated room temperature sensor in a housing with a circuit board|
    DE102010003967B3|2010-01-02|2011-02-10|Qundis Gmbh|Electronic heat cost distributor for measuring amount of heat delivered by heater, has sensor conductor plate connected with prime conductor plate by two spring elements and pressed against housing rear part by spring elements|DE102014213521A1|2014-07-11|2016-01-14|Robert Bosch Gmbh|Consumption detection device, consumption detection system and method for operating such a consumption detection system|
    DE102017218221A1|2017-10-12|2019-04-18|Robert Bosch Gmbh|thermostat|
    DE102017010899A1|2017-11-24|2019-05-29|Diehl Metering Gmbh|Consumption meter with short-range radio|
    IT201800003089A1|2018-02-27|2019-08-27|Iott Ipr 18 S R L|HEAT DISTRIBUTOR DEVICE|
    法律状态:
    2015-05-15| PC| Change of the owner|Owner name: CHRISTIAN GRADISCHNIK, AT Effective date: 20150331 |
    优先权:
    申请号 | 申请日 | 专利标题
    DE202011004344U|DE202011004344U1|2011-03-24|2011-03-24|Device for detecting the heat output of a radiator|
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